发明名称 |
Integrated circuit packaging system with step mold and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; connecting an integrated circuit die to the substrate, with the integrated circuit die having peripheral sides; molding a step mold covering one of the peripheral sides; attaching an intermediate die directly over the integrated circuit die, offset to one of the peripheral sides adjacent to the step mold; and directly connecting the intermediate die to the substrate. |
申请公布号 |
US8633058(B2) |
申请公布日期 |
2014.01.21 |
申请号 |
US201113052590 |
申请日期 |
2011.03.21 |
申请人 |
CHOI DAESIK;HA JONG-WOO;KIM SEUNG WON;STATS CHIPPAC LTD. |
发明人 |
CHOI DAESIK;HA JONG-WOO;KIM SEUNG WON |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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