发明名称 Nonvolatile semiconductor memory device and method for manufacturing same
摘要 According to one embodiment, a nonvolatile semiconductor memory device includes a first stacked structure body, a first semiconductor layer, a first organic film, a first semiconductor-side insulating film, and a first electrode-side insulating film. The first stacked structure body includes a plurality of first electrode films stacked along a first direction and a first inter-electrode insulating film provided between the first electrode films. The first semiconductor layer is opposed to side faces of the first electrode films. The first organic film is provided between the side faces of the first electrode films and the first semiconductor layer and containing an organic compound. The first semiconductor-side insulating film is provided between the first organic film and the first semiconductor layer. The first electrode-side insulating film provided between the first organic film and the side faces of the first electrode films.
申请公布号 US8633526(B2) 申请公布日期 2014.01.21
申请号 US201113234657 申请日期 2011.09.16
申请人 HATTORI SHIGEKI;ICHIHARA REIKA;TERAI MASAYA;NISHIZAWA HIDEYUKI;TADA TSUKASA;ASAKAWA KOJI;FUKE HIROYUKI;MIKOSHIBA SATOSHI;FUKUZUMI YOSHIAKI;AOCHI HIDEAKI;KABUSHIKI KAISHA TOSHIBA 发明人 HATTORI SHIGEKI;ICHIHARA REIKA;TERAI MASAYA;NISHIZAWA HIDEYUKI;TADA TSUKASA;ASAKAWA KOJI;FUKE HIROYUKI;MIKOSHIBA SATOSHI;FUKUZUMI YOSHIAKI;AOCHI HIDEAKI
分类号 H01L27/108 主分类号 H01L27/108
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