| 摘要 |
A power conversion apparatus is provided which includes a semiconductor module which include a switching element, a cooler which cools the semiconductor module, and has a pair of cylindrical pipes which introduce a cooling medium to a channel therein or discharge the cooling medium, a frame which holds the cooler, and a pair of clamps which fix the cylindrical pipes to the frame. Each of the clamps has a fastener portion which is fastened to the frame, and a pressing portion which presses the cylindrical pipe toward the frame. Each of the cylindrical pipes is held between a concave support portion, which is formed in the frame, and the clamp. Each of the cylindrical pipes is supported by two support surfaces of the concave support portion and the pressing portion of the clamp at three support points when viewing from the direction in which the cylindrical pipe extends. |
