发明名称 System for dissipating heat energy
摘要 A sustainable system for cooling at least one electronic device, for example a Light Emitting Diode (LED), and preferably a plurality of electronic devices, using at least one heat absorbing material contained within a housing that it is in thermal communication with the electronic devices. The heat absorbing materials may be present individually or in combinations thereof in order to achieve the desired heat absorption effect; the housing may include multiple chambers containing heat absorbing materials or combinations thereof.
申请公布号 US8631855(B2) 申请公布日期 2014.01.21
申请号 US20080192470 申请日期 2008.08.15
申请人 MAXIK FREDRIC S.;HENDERSON DAVID;BASTIEN VALERIE;LIGHTING SCIENCE GROUP CORPORATION 发明人 MAXIK FREDRIC S.;HENDERSON DAVID;BASTIEN VALERIE
分类号 F28D17/00;F28D15/00;F28D19/00 主分类号 F28D17/00
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