| 发明名称 |
Hybrid interconnect technology |
| 摘要 |
In one embodiment, an interconnect structure between an integrated circuit (IC) chip and a substrate comprises a plurality of materials. |
| 申请公布号 |
US8633592(B2) |
申请公布日期 |
2014.01.21 |
| 申请号 |
US201113190761 |
申请日期 |
2011.07.26 |
| 申请人 |
LEE MICHAEL G.;UCHIBORI CHIHIRO;CISCO TECHNOLOGY, INC. |
发明人 |
LEE MICHAEL G.;UCHIBORI CHIHIRO |
| 分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
