| 摘要 |
PURPOSE:To enhance the bonding strength of the brazing portion between the lead wire of the device and the semiconductor chip by providing a rigidity alleviating portion in the connecting portion between the straight line portion and the header portion of the lead wire. CONSTITUTION:The lower surface of a semiconductor chip 2 is brazed to the upper surface of an electromagnetic plate 1 which also serves as a cooler. The lead wire header portion 3a is brazed to the upper surface of the chip 2, and the straight portion 3b reaching the header portion 3a is supported on an insulating terminal base 6 fixed to the electromagnetic plate 1. At this time, a rigidity alleviating portion 3c is provided in the connecting portion between the straight portion 3b and the header portion 3a. With this, reduction i the stress applied to the chip 2 when a bending stress acts on the end of the straight portion 3b of the lead wire 3 as shown by an arrow A is achieved simultaneously with the improvement of the bonding strength in the header portion 3a and a brazing material 4b when a vertical stress acts as shown by an arrow B. |
