Methods and apparatus for controlling substrate temperature in a process chamber
摘要
Methods and apparatus for controlling the temperature of a substrate during processing are provided herein. In some embodiments, an apparatus for retaining and controlling substrate temperature may include a puck of dielectric material; an electrode disposed in the puck proximate a surface of the puck upon which a substrate is to be retained; and a plurality of heater elements disposed in the puck and arranged in concentric rings to provide independent temperature control zones.
申请公布号
US8633423(B2)
申请公布日期
2014.01.21
申请号
US201113097822
申请日期
2011.04.29
申请人
LIN XING;BUCHBERGER, JR. DOUGLAS A.;ZHOU XIAOPING;TODOROW VALENTIN;NGUYEN ANDREW;SHEYNER ANCHEL;APPLIED MATERIALS, INC.
发明人
LIN XING;BUCHBERGER, JR. DOUGLAS A.;ZHOU XIAOPING;TODOROW VALENTIN;NGUYEN ANDREW;SHEYNER ANCHEL