发明名称 |
Device and method for manufacturing a device |
摘要 |
A device includes a semiconductor material having a first surface. A first material is applied to the first surface and a fiber material is embedded in the first material. |
申请公布号 |
US8633600(B2) |
申请公布日期 |
2014.01.21 |
申请号 |
US20100886851 |
申请日期 |
2010.09.21 |
申请人 |
MENGEL MANFRED;MAHLER JOACHIM;HOSSEINI KHALIL;INFINEON TECHNOLOGIES AG |
发明人 |
MENGEL MANFRED;MAHLER JOACHIM;HOSSEINI KHALIL |
分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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