发明名称 Copper foil attached to the carrier foil, a method for preparing the same and printed circuit board using the same
摘要 Provided is an ultra-thin copper foil to which a carrier foil is attached, including: a carrier foil, a peeling layer, and an ultra-thin copper foil, wherein the peeling layer includes a first metal A having peelability, a second metal B and a third metal C facilitating coating of the first metal, wherein the amount (a) of the first metal A is in a range of about 30 to about 89% by total weight of the peeling layer, the amount (b) of the second metal B is in a range of about 10 to about 60% by total weight of the peeling layer, and the amount (c) of the third metal C is in a range of about 1 to about 20% by total weight of the peeling layer.
申请公布号 KR101351928(B1) 申请公布日期 2014.01.21
申请号 KR20070140522 申请日期 2007.12.28
申请人 发明人
分类号 B32B15/04;C25D3/00;H05K1/03;H05K1/09 主分类号 B32B15/04
代理机构 代理人
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