发明名称 |
In-situ dendritic treatment of electrodeposited foil |
摘要 |
The present invention relates to a process and apparatus for forming in situ surface treated metal foil. The apparatus includes a cathode and anode arranged and/or shaped to define a plating region characterized by a first zone having a first interelectrode gap and a second zone having a second interelectrode gap smaller than the first interelectrode gap. It has been found that by providing such an arrangement it is possible to generate in the first zone a localized current density below the limiting current density sufficient to plate metal foil onto the cathode and to simultaneously generate in the second zone a localized current density above the limiting current density sufficient to form dendrites on the freshly produced foil.
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申请公布号 |
US4692221(A) |
申请公布日期 |
1987.09.08 |
申请号 |
US19860944776 |
申请日期 |
1986.12.22 |
申请人 |
OLIN CORPORATION |
发明人 |
PARTHASARATHI, ARVIND |
分类号 |
C25D1/04;C25D5/16;H05K3/24;H05K3/38;(IPC1-7):C25D1/04 |
主分类号 |
C25D1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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