发明名称 |
Method of processing cavity of core substrate |
摘要 |
A method of processing a cavity of a core substrate is disclosed. The method of processing a cavity of a core substrate in accordance with an embodiment of the present invention can include: forming a first processing area on one surface of a core substrate, the first processing area being demarcated by a circuit pattern; forming a second processing area on the other surface of the core substrate, the second processing area being demarcated by a circuit pattern; and processing a cavity by removing the entire first processing area from the one surface of the core substrate. |
申请公布号 |
US8633397(B2) |
申请公布日期 |
2014.01.21 |
申请号 |
US20100860301 |
申请日期 |
2010.08.20 |
申请人 |
JEONG JIN-SOO;LEE DOO-HWAN;PARK HWA-SUN;LEE JAE-KUL;CHUNG YUL-KYO;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
JEONG JIN-SOO;LEE DOO-HWAN;PARK HWA-SUN;LEE JAE-KUL;CHUNG YUL-KYO |
分类号 |
H05K1/16 |
主分类号 |
H05K1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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