Integrated and sealed opto-electronic device assembly

摘要

An opto-electronic device assembly adapted for mounted on a mother board includes a case and opto-electronic devices. The case has multiple cavities opening forwards and downwards. Each opto-electronic device includes an optical engine module and an electrical socket. The optical engine module includes an optical engine, an optical transmission interface and an electrical transmission interface with electrical pads. The electrical socket has a plurality of terminals with one ends contacting with PCB and another opposite ends contacting with the electrical pads. Each electrical transmission interface is removeably assembled in the electrical sockets to complete electrical connection between the substrate and the mother board. The opto-electrical devices are received in the cavities in a condition that the optical transmission interfaces exposes to a front open of the case.