IC package with integrated electrostatic discharge protection

摘要

There is disclosed an integrated circuit (IC) package or semiconductor package including integrated spark or arc gaps which are uniquely configured to reduce the susceptibility of the package to being damaged from an electrostatic discharge (ESD) event. In an exemplary embodiment, each arc gap is collectively defined by an arc gap extension integrally connected to and protruding from the die pad of the package, and a corresponding lead thereof.