| 摘要 |
The present invention relates to a method for bonding using photo-curing and, more specifically, to a method for bonding using photo-curing which comprises: a first curing step of irradiating a surface of a coupled substrate, wherein a lower substrate and an upper substrate are coupled, with a single wavelength UV light source device, and curing the same; a second step of irradiating a surface of the coupled substrate that has undergone the first curing step with a multi-wavelength UV light source device, and curing the same, thereby using the two curing steps to overcome a weakness of bending in the substrate by reducing a generated heat when curing the coupled substrate, which is vulnerable to heat, and to enhance productivity of the substrate by reducing a long time required for multi-wavelength curing in existing methods. |
