发明名称 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component, and a manufacturing method therefor.SOLUTION: The multilayer ceramic electronic component of the present invention includes a ceramic body having a dielectric layer, a plurality of internal electrodes arranged in the ceramic body to face each other via the dielectric layer, an external electrode coupled electrically with the internal electrodes. The ceramic body includes an active layer, i.e., a capacity formation part, and a cover layer C, i.e., a capacity non-formation part, formed on at least one of the upper and lower surfaces of the active layer. The length of the ceramic body cut at a central part in the width W direction thereof, and the average thickness td of the cover layer C in the cross section of the thickness direction L-T are 15 μm or less. The external electrode contains conductive metal and glass, and when an area occupied by the glass in the external electrode is A, and an area occupied by the conductive metal is B, the following relation is satisfied; 0.05≤A/B≤0.6. The manufacturing method for the multilayer ceramic electronic component is also provided.
申请公布号 JP2014011450(A) 申请公布日期 2014.01.20
申请号 JP20120213706 申请日期 2012.09.27
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 GU HYUN-HEE;PARK MYUN-CHON;LEE KYU HA;CHE DA-YONG;PARK JAE YOUNG;KWON SANG HOON;JEON BYUNG JUN
分类号 H01G4/30;H01G4/12;H01G4/232 主分类号 H01G4/30
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