发明名称 THERMOELECTRIC COOLING MODULE AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a thermoelectric cooling module and a manufacturing method of the thermoelectric cooling module.SOLUTION: A thermoelectric cooling module includes: first and second substrates in which metal electrodes are formed, the first and second substrates facing each other; and multiple thermoelectric elements formed between the first substrate and the second substrate. The first and second substrates include aluminum layers and alumina (AlO) layers formed at parts of facing surfaces of the aluminum layers. Providing the thermoelectric cooling module reduces joint resistance thereby improving the efficiency of the thermoelectric cooling module and reducing the costs.
申请公布号 JP2014011469(A) 申请公布日期 2014.01.20
申请号 JP20130136551 申请日期 2013.06.28
申请人 LG INNOTEK CO LTD 发明人 LEE JONG MIN
分类号 H01L35/30;H01L35/32 主分类号 H01L35/30
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