| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that when a bump and an alignment mark are formed on an insulation substrate in a plating method, the bump and the alignment mark are apt to be uneven in height.SOLUTION: There is provided a method of manufacturing a wiring board which has wiring 3 formed on an insulation substrate 2, a bump 4 formed on a land 7 of the wiring 3, and an alignment mark 5 formed on the insulation substrate 2, the method including the steps of: forming first resist patterns (13, 14) on a copper foil 11 formed on the insulation substrate 2; forming the bump 4 and the alignment mark 5 on a surface of the copper foil 11 at the same time by half-etching the copper foil 11 using the first resist patterns as a mask; forming second resist patterns (17, 18) corresponding to the shape of the wiring 3 and the shape of a pedestal part 8 of the alignment mark 5 on the copper foil 11; and forming the wiring 3 on the insulation substrate 2 by half-etching the copper foil 11 using the second resist patterns as a mask. |
