| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser dicing method for realizing excellent cutting characteristics for a processed substrate on the surface of which a metal film is formed, by optimizing an irradiation condition of a pulse laser beam.SOLUTION: A laser dicing method of a processed substrate comprising a metal film on the surface includes: a first metal film peeling step of peeling the metal film by irradiating the metal film with a defocused pulse laser beam along a first straight line; a second metal film peeling step of peeling the metal film by irradiating the metal film with the defocused pulse laser beam along a second straight line perpendicular to the first straight line; and a crack formation step of forming a crack on the processed substrate by irradiating an area where the metal film of the processed substrate has been peeled with the pulse laser beam, and interrupts the irradiation with the pulse laser beam in either of the first metal film peeling step or the second metal film peeling step in an area where the first straight line crosses the second straight line. |
