| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder alloy that contains a reduced amount of silver and thereby reduces a cost, can secure superior wettability and further can suppress the generation of voids (gaps); a solder paste containing the solder alloy; and an electronic circuit board obtained by using the solder paste.SOLUTION: A tin-silver-copper based solder alloy contains tin, silver, copper, nickel, antimony, bismuth and indium, and does not substantially contain germanium. A ratio of silver contained in the solder alloy is set at more than 0.05 mass% and less than 0.2 mass% and a ratio of antimony contained in the solder alloy is set at 0.01 mass% or more and less than 2.5 mass% to a total amount of the solder alloy. |
