| 摘要 |
PROBLEM TO BE SOLVED: To provide a coating film forming technique using a spin coating on a wafer W capable of obtaining a high flatness coating film and to provide a substrate processing method and a substrate processing device capable of satisfactorily performing exposure on circumference of a substrate by utilizing the technique.SOLUTION: When performing the spin coating on a wafer W, a solvent is supplied to an elevation part of a coating film formed in a circumference portion of the wafer W, and a solvent supplying part is moved toward the center of the wafer W. When the wafer W is spun, the more solvent is supplied to a point closer to the circumference of the coating film, and the fluidity is increased in the elevation part 39. With the sputtering by spinning of the wafer W, coating film of high flatness can be obtained even in a circumference portion and bubbles are hardly trapped in the elevation part 39 while performing the flattening processing on the coating film. |
