ELECTRODE FOR Sn PLATING AND Sn PLATING DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an electrode for Sn plating capable of suppressing the sticking of Sn based deposits to the electrode and satisfactorily preventing the generation of the unevenness in plating, and an Sn plating device using the same.SOLUTION: An electrode 1 comprises: an electrode substrate 10; and a discharge member 20. The discharge member 20 includes: an active substance support 21 made of either a metal mesh or an expand metal; and a through hole 23 allowing a plating liquid to communicate from the discharge face side toward the opposite side thereof. The electrode substrate 10 includes a plurality of columnar members 12 (installation members) installed in a frame body 11, and an opening part 13 of fluidizing the plating liquid from the side to be fitted with the discharge member 20 toward the opposite side thereof is formed between the frame body 11 and the columnar members (installation members) 12. Provided that the total area of the whole of the discharge member 20 is defined as S1 and the total area of the frame body 11 and the columnar members 12 overlapped with the whole of the discharge member 20 is defined as S2 in a frontal projected view, the first opening ratio K1=(S1-S2)/S1 is controlled to 0.60 to 0.90.