发明名称 PACKAGING MATERIAL AND PACKAGING BODY
摘要 PROBLEM TO BE SOLVED: To provide a packaging material, even in the case of either an article to be packaged, connected with a circuit board through a flexible circuit on a side part of a panel, or an article to be packaged, comprising only a panel, capable of packaging the articles by using both a container body and a lid body in common.SOLUTION: A packaging material 1 is for packaging by selecting a first article P1 to be packaged, connected with a circuit board Pb through a flexible circuit Pf on a side part Ps of a panel Pa, and a second article P2 to be packaged, comprising a rectangular panel. The packaging material 1 includes a container body 20 and a lid body 10. A board storage recess 21c for storing a circuit board Pb is formed on a side edge part 21b of a bottom 21a of the storage recess 21 of the container body 20. Corner parts 21d and 21d on a side in which the board storage recess 21c is formed are provided with a corner protective member 30 which detachably fits to the container body 20 and protects a corner Pc of a panel Pa of the first article P1 to be packaged.
申请公布号 JP2014009020(A) 申请公布日期 2014.01.20
申请号 JP20120147857 申请日期 2012.06.29
申请人 SEKISUI PLASTICS CO LTD 发明人 ONO YASUHIRO;HIROBE YOSHIO;INOSE MITSURU
分类号 B65D85/48;B65D81/133;B65D85/86 主分类号 B65D85/48
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