发明名称 PRINTED BOARD AND LIGHT-EMITTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a printed board capable of highly effectively cutting off a plated lead wire on its way after electrolytic plating.SOLUTION: Between a conductor pattern 22 formed on a substrate 23 of a printed board 20 and an outer edge 23a of the substrate 23, a plated lead wire 21 at least having a straight lead section on its way is formed. After electrolytic plating is provided on the conductor pattern 22, the straight lead section of the plated lead wire 21 is removed by being cut in its axial direction. Thus, the plated lead wire 21 is electrically cut.
申请公布号 JP2014011444(A) 申请公布日期 2014.01.20
申请号 JP20120149566 申请日期 2012.07.03
申请人 MITSUBISHI ELECTRIC CORP;MITSUBISHI ELECTRIC CORP 发明人 ISHII KENGO
分类号 H05K3/22;F21V19/00;F21V23/00;H01L33/62;H05K1/02 主分类号 H05K3/22
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