发明名称 ELECTRO-OPTIC MODULE, METHOD FOR MANUFACTURING ELECTRO-OPTIC MODULE, AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide an electro-optic module in which a mold resin can be selectively disposed at a predetermined position between a flexible wiring board and an element substrate while holding a leading part of the flexible wiring board in a predetermined shape inside a case, and to provide a method for manufacturing the electro-optic module and electronic equipment including the electro-optic module.SOLUTION: In an electro-optic module 10, a flexible wiring board 90 is bent so as to be apart from an element substrate 51 by a first projection 72 of an exit-side parting member 70 and a second projection 62 of a frame 60. A case 30 for accommodating an electro-optic panel 40 is provided with a second opening 32 through which a position to dispose a mold resin R1 is visible from the outside; and no shielding member is present between the position where the mold resin R1 is to be disposed and the second opening 32. Therefore, after the electro-optic panel 40 is accommodated in the case 30, the mold resin R1 can be applied by inserting a nozzle P through the second opening 32.
申请公布号 JP2014010377(A) 申请公布日期 2014.01.20
申请号 JP20120148201 申请日期 2012.07.02
申请人 SEIKO EPSON CORP 发明人 NISHIOMOTE MUNEHIDE
分类号 G09F9/00;G02F1/1333 主分类号 G09F9/00
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