摘要 |
PROBLEM TO BE SOLVED: To provide an electro-optic module in which a mold resin can be selectively disposed at a predetermined position between a flexible wiring board and an element substrate while holding a leading part of the flexible wiring board in a predetermined shape inside a case, and to provide a method for manufacturing the electro-optic module and electronic equipment including the electro-optic module.SOLUTION: In an electro-optic module 10, a flexible wiring board 90 is bent so as to be apart from an element substrate 51 by a first projection 72 of an exit-side parting member 70 and a second projection 62 of a frame 60. A case 30 for accommodating an electro-optic panel 40 is provided with a second opening 32 through which a position to dispose a mold resin R1 is visible from the outside; and no shielding member is present between the position where the mold resin R1 is to be disposed and the second opening 32. Therefore, after the electro-optic panel 40 is accommodated in the case 30, the mold resin R1 can be applied by inserting a nozzle P through the second opening 32. |