发明名称 |
FILM FORMING METHOD, FILM FORMING DEVICE AND STORAGE MEDIUM |
摘要 |
PROBLEM TO BE SOLVED: To provide a film forming method for controlling stress generated in a thin film with a layer of aluminium nitride or silicon nitride.SOLUTION: A film forming method forms a thin film by laminating molecular layers of a reaction product consisting of aluminium nitride or silicon nitride on a substrate w mounted on a turntable 2 while revolving the substrate w in a vacuum container 12. First processing gas being raw material gas for producing the reaction product is supplied to the substrate 2 while revolving the substrate w by rotating the turntable 2. Then, second processing gas being gas for nitriding the first processing gas is supplied at positions arranged spaced apart in a circumferential direction of the turntable 2 relative to a position where the first processing gas is supplied to the substrate w. After that, the molecular layers of the reaction product formed on the substrate w is irradiated with ultraviolet rays to control stress generated in the thin film. |
申请公布号 |
JP2014011357(A) |
申请公布日期 |
2014.01.20 |
申请号 |
JP20120147711 |
申请日期 |
2012.06.29 |
申请人 |
TOKYO ELECTRON LTD |
发明人 |
IGETA MASANOBU;SATO JUN;YABE KAZUO;KATO HISASHI;IZAWA YUSAKU |
分类号 |
H01L21/31;C23C16/34;C23C16/455;H01L21/336;H01L21/768;H01L23/532;H01L29/78 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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