发明名称 FILM FORMING METHOD, FILM FORMING DEVICE AND STORAGE MEDIUM
摘要 PROBLEM TO BE SOLVED: To provide a film forming method for controlling stress generated in a thin film with a layer of aluminium nitride or silicon nitride.SOLUTION: A film forming method forms a thin film by laminating molecular layers of a reaction product consisting of aluminium nitride or silicon nitride on a substrate w mounted on a turntable 2 while revolving the substrate w in a vacuum container 12. First processing gas being raw material gas for producing the reaction product is supplied to the substrate 2 while revolving the substrate w by rotating the turntable 2. Then, second processing gas being gas for nitriding the first processing gas is supplied at positions arranged spaced apart in a circumferential direction of the turntable 2 relative to a position where the first processing gas is supplied to the substrate w. After that, the molecular layers of the reaction product formed on the substrate w is irradiated with ultraviolet rays to control stress generated in the thin film.
申请公布号 JP2014011357(A) 申请公布日期 2014.01.20
申请号 JP20120147711 申请日期 2012.06.29
申请人 TOKYO ELECTRON LTD 发明人 IGETA MASANOBU;SATO JUN;YABE KAZUO;KATO HISASHI;IZAWA YUSAKU
分类号 H01L21/31;C23C16/34;C23C16/455;H01L21/336;H01L21/768;H01L23/532;H01L29/78 主分类号 H01L21/31
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