| 摘要 |
PROBLEM TO BE SOLVED: To suppress thinning of wiring when a bump is formed on the wiring by half-etching.SOLUTION: As steps of manufacturing a wiring board 1 including an insulation substrate 2, wiring 3 formed on the insulation substrate 2, and a bump 4 formed on the wiring 3, a method includes a wiring pattern forming step of forming a wiring pattern 3p on the insulation substrate 2 by etching a copper foil 11 formed on one surface of the insulation substrate 2, and a bump forming step of forming the bump 4 on the wiring 3 by half-etching the wiring pattern 3p except a part of the wiring pattern 3p where the bump 4 is to be formed. In the bump forming step, a resist pattern part 17b is formed partially on the insulation substrate 2 and at positions opposed to side faces 3c and 3d of the wiring pattern 3p while leaving gaps which are large enough to suppress etching of the side faces 3c and 3d of the wiring 3 due to the half-etching, and then the wiring pattern 3p is half-etched. |
