| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive tape for processing that can reduce warpage of a semiconductor wafer, dimple of the back surface of the semiconductor wafer, adhesive deposit onto a surface electrode and pollution of the surface and enable grinding of wafer thin film.SOLUTION: In an adhesive tape for semiconductor wafer processing, one or more low elastic modulus layers 2 are provided on one surface of a base material film 1, an adhesive layer 3 is provided on the low elastic modulus layer(s), the Young's modulus of the base material film 1 is equal to eighth power Pa of 5.0x10 to tenth power Pa of 1.1×10, the elastic modulus G'(25°C) of the low elastic modulus layer(s) 2 is equal to fifth power Pa of 2.5×10 to fifth power Pa of 4.0×10, the elastic modulus G'(60°C) is equal to fifth power Pa of 0.2×10 to fifth power Pa of 1.5×10, the rate of the elastic modulus G'(25°C) to the elastic modulus G'(60°C) is equal to 0.5 or less, the loss tangent tanδ(25°C) is equal to 0.08 to 0.15, the rate of the loss tangent tanδ(25°C) to the loss tangent tanδ(60°C) is equal to 4.0 or more, the thickness of the adhesive layer 3 is equal to 5 to 100 μm, and the thickness of the radiation hardenable type adhesive layer/the thickness of the low elastic modulus layer is equal to 1/2 or less. |
