| 摘要 |
PROBLEM TO BE SOLVED: To provide a component mounting device capable of suppressing vibration of a substrate on which an electronic component is mounted.SOLUTION: A component mounting device 1 includes a transfer rail 51 for transferring a substrate 52, on which an electronic component 6 is mounted, while supporting both ends thereof, and a plurality of backup parts 8 for supporting the substrate 52 from below. The backup part 8 has a contact 9 which is pressed telescopically and comes into contact with the substrate 52 from below, and a stopper 11 for limiting the amount of downward displacement of the contact 9. Preferably, the contact 9 comes into contact with the substrate 52 in such a state that the downward displacement of the substrate 52 is stopped at the lower limit of displacement range. Preferably, the backup part 8 has a damper 12 for attenuating telescopic motion of the contact 9. |
