发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE RESIN LAMINATE
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive resin laminate made of a photosensitive resin composition excellent in sensitivity, resolution, developer dispersibility and color stability; and a resist pattern forming method and a conductor pattern forming method using the photosensitive resin laminate.SOLUTION: The photosensitive resin composition contains: 10-90 mass% of (A) an alkali-soluble polymer; 5-70 mass% of (B) a compound having an ethylenic double bond; 0.01-20 mass% of (C) a photoinitiator; and 0.001-10 mass% of (D) a hindered phenol. The acid equivalent of the (A) alkali-soluble polymer is 100-600, and the weight-average molecular weight thereof is 5,000-500,000. The (C) photoinitiator includes an acridine compound.
申请公布号 JP2014010333(A) 申请公布日期 2014.01.20
申请号 JP20120147428 申请日期 2012.06.29
申请人 ASAHI KASEI E-MATERIALS CORP 发明人 MATSUDA TAKAYUKI;KOSAKA JUNYA
分类号 G03F7/004;G03F7/031;G03F7/033;H01L21/027;H05K3/06;H05K3/18 主分类号 G03F7/004
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