发明名称 POLYMERIC COMPOUND, RESIN COMPOSITION FOR PHOTORESIST, AND METHOD FOR MANUFACTURING SEMICONDUCTOR
摘要 PROBLEM TO BE SOLVED: To provide a polymeric compound, a resin composition for a photoresist, and a method for manufacturing a semiconductor, exhibiting excellent sensitivity and resolution and small line edge roughness (LER), allowing formation of a fine pattern with high accuracy, and capable of reducing generation of development defects.SOLUTION: The polymeric compound includes at least a monomer unit (a) expressed by formula (a) below and a monomer unit (b) including an alicyclic skeleton having a polar group.
申请公布号 JP2014009320(A) 申请公布日期 2014.01.20
申请号 JP20120147875 申请日期 2012.06.29
申请人 DAICEL CORP 发明人 NISHIMURA MASAMICHI;EGUCHI AKIYOSHI;ONO MITSURU
分类号 C08F220/18;C08F220/28;C08F220/36;C08F220/38;G03F7/039;H01L21/027 主分类号 C08F220/18
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