发明名称 |
POLYMERIC COMPOUND, RESIN COMPOSITION FOR PHOTORESIST, AND METHOD FOR MANUFACTURING SEMICONDUCTOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a polymeric compound, a resin composition for a photoresist, and a method for manufacturing a semiconductor, exhibiting excellent sensitivity and resolution and small line edge roughness (LER), allowing formation of a fine pattern with high accuracy, and capable of reducing generation of development defects.SOLUTION: The polymeric compound includes at least a monomer unit (a) expressed by formula (a) below and a monomer unit (b) including an alicyclic skeleton having a polar group. |
申请公布号 |
JP2014009320(A) |
申请公布日期 |
2014.01.20 |
申请号 |
JP20120147875 |
申请日期 |
2012.06.29 |
申请人 |
DAICEL CORP |
发明人 |
NISHIMURA MASAMICHI;EGUCHI AKIYOSHI;ONO MITSURU |
分类号 |
C08F220/18;C08F220/28;C08F220/36;C08F220/38;G03F7/039;H01L21/027 |
主分类号 |
C08F220/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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