发明名称 POLYMERIC COMPOUND, RESIN COMPOSITION FOR PHOTORESIST, AND METHOD FOR MANUFACTURING SEMICONDUCTOR
摘要 PROBLEM TO BE SOLVED: To provide a polymeric compound, a resin composition for a photoresist, and a method for manufacturing a semiconductor, exhibiting excellent sensitivity, resolution, and etching durability, small line edge roughness and high accuracy of a fine pattern, and capable of reducing generation of development defects.SOLUTION: The polymeric compound includes a monomer unit (a) expressed by formula (a) below, at least one unit (b) selected from four units including a specified structure, and at least one monomer unit (c) including an alicyclic skeleton having a polar group excluding the unit (b).
申请公布号 JP2014009319(A) 申请公布日期 2014.01.20
申请号 JP20120147874 申请日期 2012.06.29
申请人 DAICEL CORP 发明人 NISHIMURA MASAMICHI;EGUCHI AKIYOSHI;ONO MITSURU
分类号 C08F220/28;C08F220/18;G03F7/039;H01L21/027 主分类号 C08F220/28
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