| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, in a semiconductor manufacturing apparatus, machining accuracy is reduced by enclosing generated heat in a central part of a semiconductor silicon wafer to be machined.SOLUTION: A passage member 101-104 comprises a cover body part 1, a sidewall part 2 and a bottom plate part 3 and includes a passage 10 which is composed of the cover body part 1, the sidewall part 2 and the bottom plate part 3 and in which an outer peripheral portion 10b and a central portion 10a are connected and a fluid 11 flows. The sidewall part 2 includes ruggedness 5 at a side of the passage 10 and a maximum difference 5a in the ruggedness 5 is larger in the central portion 10a than in the outer peripheral portion 10b of the passage member 101-104. Therefore, efficiency of heat exchange with the fluid 11 can be improved in the central portion 10a of the passage member 101-104. By means of a heat exchanger 201 employing the passage member and a semiconductor manufacturing apparatus 301, machining accuracy of a semiconductor silicon wafer 29 can be prevented from being reduced. |
