THROUGH ELECTRODE SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a through electrode substrate capable of reducing stress that may cause destruction occurring during silicon wafer lamination, and to provide a manufacturing method of the through electrode substrate which prevents the increase of device costs even when the silicon wafer size is increased.SOLUTION: A through electrode substrate 65 is used for connecting a silicon substrate 63A with a silicon substrate 63B through a through electrode 61 after the silicon substrates 63A and 63B are laminated in a thickness direction. A resin is used for a base material 60 of the through electrode substrate.