发明名称 GLASS SUBSTRATE ETCHING APPARATUS AND GLASS SUBSTRATE ETCHING METHOD
摘要 PROBLEM TO BE SOLVED: To etch uniformly the whole area of a glass substrate to form a uniformly-rugged shape on the glass surface upon etching the glass substrate for a solar cell by using etching gas.SOLUTION: A glass substrate etching apparatus comprises supplying means to supply processing gas for etching a glass substrate held by substrate holding means in a processing chamber, discharging means including a gas storing chamber positioned as facing a substrate holding plane of the substrate holding means and supplied with the processing gas and a shower plate which is provided at the substrate holding means side and allows the processing chamber and the gas storing chamber to communicate with each other through plural holes, and exhausting means to exhaust gas in the gas storing chamber. The supplying means and the exhausting means are connected to the discharging means, the discharging means discharges the processing gas supplied from the supplying means to the gas storing chamber into the processing chamber through the holes of the shower plate, and the exhausting means is able to seal the processing chamber and the discharging means by exhausting gas in the processing chamber through the gas storing chamber and cutting off the supplying means and the exhausting means while the gas storing chamber is being communicated with the processing chamber through the holes.
申请公布号 JP2014009143(A) 申请公布日期 2014.01.20
申请号 JP20120148572 申请日期 2012.07.02
申请人 MITSUBISHI ELECTRIC CORP 发明人 TSUDA MUTSUMI;TOMOHISA SHINGO;TAKI MASAKAZU
分类号 C03C15/00;C03C23/00;H01L21/302;H01L31/04 主分类号 C03C15/00
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