SUBSTRATE FOR POWER MODULE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a less expensive substrate for power modules capable of accurately positioning a semiconductor element when the semiconductor element is bonded on a circuit copper plate with a bonding material and preventing the semiconductor element from being positionally deviated by the bonding material flow, and a method for manufacturing the substrate.SOLUTION: A substrate 10 for power modules includes: a circuit copper plate 12 for mounting a semiconductor element 20 on a principal surface of a ceramic substrate 11 and 11a to form an electrical conductive state; and a heat dissipation copper plate 13 for dissipating heat generated from a semiconductor element 20 to the other principal surface. An upper surface of the circuit copper plate 12 having the semiconductor element 20 bonded through a bonding material 24a has a recessed pattern 14 having a width part having a size of 0.05 mm or more and a depth of more than 0 mm and 80% or less of the thickness of the circuit copper plate and covered with the semiconductor element 20 which straddles at least a part of the width part.