发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device having high latch-up resistance; and provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device comprises: a first conductivity type semiconductor substrate; a first conductivity type first well formed in a first region of the semiconductor substrate; a second conductivity type first transistor formed in the first well; a second conductivity type second well which is formed in an annular second region surrounding the first region and which touches a lateral face of the first well; a second conductivity type deep well layer formed on a bottom face of the first well and a bottom face of the second well in a contacting manner; a second conductivity type third well formed in a third region adjacent to the second region; and a first conductivity type second transistor formed in the third well. An impurity concentration in the second well is higher than an impurity concentration in the third well.
申请公布号 JP2014011336(A) 申请公布日期 2014.01.20
申请号 JP20120147400 申请日期 2012.06.29
申请人 FUJITSU SEMICONDUCTOR LTD 发明人 SUZUKI TERUO;OTA KAZUTOSHI;WATANABE KENJI;ASANO MASAYOSHI
分类号 H01L21/8238;H01L21/822;H01L27/04;H01L27/06;H01L27/092 主分类号 H01L21/8238
代理机构 代理人
主权项
地址