发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having high latch-up resistance; and provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device comprises: a first conductivity type semiconductor substrate; a first conductivity type first well formed in a first region of the semiconductor substrate; a second conductivity type first transistor formed in the first well; a second conductivity type second well which is formed in an annular second region surrounding the first region and which touches a lateral face of the first well; a second conductivity type deep well layer formed on a bottom face of the first well and a bottom face of the second well in a contacting manner; a second conductivity type third well formed in a third region adjacent to the second region; and a first conductivity type second transistor formed in the third well. An impurity concentration in the second well is higher than an impurity concentration in the third well. |
申请公布号 |
JP2014011336(A) |
申请公布日期 |
2014.01.20 |
申请号 |
JP20120147400 |
申请日期 |
2012.06.29 |
申请人 |
FUJITSU SEMICONDUCTOR LTD |
发明人 |
SUZUKI TERUO;OTA KAZUTOSHI;WATANABE KENJI;ASANO MASAYOSHI |
分类号 |
H01L21/8238;H01L21/822;H01L27/04;H01L27/06;H01L27/092 |
主分类号 |
H01L21/8238 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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