WIRING BOARD, SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING WIRING BOARD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a wiring board which is capable of thinning a semiconductor device while suppressing lowering of handleability in a manufacturing process, and to provide a semiconductor device.SOLUTION: A wiring board 1 includes an adhesive layer 20, a wiring layer 30 formed on an upper surface 20A of the adhesive layer 20, and a support substrate 10 formed on a lower surface 20B of the adhesive layer 20. The wiring layer 30 includes a pad 31 and a bonding pad 32. A part of the pad 31 is exposed from a through hole 20X penetrating the adhesive layer 20 and the support substrate 10 in the thickness direction. The support substrate 10 is peelably adhered to the adhesive layer 20.