| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can uniformly apply a current by a plurality of semiconductor chips; and provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device according to an embodiment comprises: a plurality of first semiconductor chips; and a circuit board on which a plurality of first semiconductor chips are mounted and which has first and second wiring conductors which are electrically connected with the plurality of first semiconductor chips. The plurality of first semiconductor chips are connected in parallel to configure a first parallel circuit together with the first and second wiring conductors. The plurality of first semiconductor chips are arranged on the circuit board depending on on-resistance of each of the plurality of first semiconductor chips such that uniform current flows through the plurality of first semiconductor chips. |
