发明名称 HEAT PUMP SYSTEM
摘要 PROBLEM TO BE SOLVED: To heat pump system that can heat an object fluid while continuing the operation of a refrigerant circuit, without suppressing the heating amount of a heat medium by an auxiliary heating part.SOLUTION: A heat pump system 10 includes: a Peltier element 2b that absorbs heat from a heat medium heading from a heating heat exchanger 22 of a heat medium circuit 20 to a radiator 12, and discharges heat to a heat medium heading from the radiator 12 of the heat medium circuit 20 to the heating heat exchanger 22; and a controller 40 that performs a first operation controlling the operation of the Peltier element 2b so that the inlet temperature of a heat medium of the radiator 12 is lower than the outlet temperature of a refrigerant of the radiator 12 and the water temperature of a thermostat bath 23 approaches a target temperature.
申请公布号 JP2014009899(A) 申请公布日期 2014.01.20
申请号 JP20120147831 申请日期 2012.06.29
申请人 DAIKIN IND LTD 发明人 MORIWAKI MICHIO;OKAMOTO MASAKAZU
分类号 F25B21/02;F25B1/00;F25B30/02 主分类号 F25B21/02
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