POLISHING LIQUID COMPOSITION FOR SEMICONDUCTOR SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a polishing liquid composition for a semiconductor substrate which is good for polishing selectivity of an oxide film in polishing the semiconductor substrate and is well utilized for manufacturing the semiconductor substrate having excellent flatness.SOLUTION: A polishing liquid composition for semiconductor substrate contains polyuronic acid having a &bgr;1→4 bond, ceria particle and aqueous medium. Such polyuronic acid is favorable as the one having a structure that part or all of hydroxymethyl group of a sixth polysaccharide is replaced by a carboxy group and one or more groups chosen among salt of carboxy groups and such a polysaccharide is favorable as cellulose.