| 摘要 |
Thermoplastic moulding compositions containing A) from 10 to 99.9% by weight of a thermoplastic polyamide, B) from 0.1 to 20% by weight of a terpolymer which can be obtained by copolymerization of (B1) from 1 to 70% by weight of at least one electron-deficient olefin, (B2) from 0 to 85% by weight of at least one olefin which bears only hydrogen atoms and/or carbon atoms and no electron-pulling substituents on its olefinic double bond and (B3) from 1 to 99% by weight of at least one alkoxyvinylsilane, C) from 0 to 50% by weight of a fibrous or particulate filler or a mixture thereof, D) from 0 to 50% by weight of further additives, where the sum of the percentages by weight of the components A) to D) is 100%. |
