发明名称 ELECTRONIC DEVICE AND ITS MANUFACTURE
摘要 <p>PURPOSE:To improve a damp-proof property, by fixing a resinous small piece on the rear surface of a pellet and bonding the pellet on a metallic surface through this small piece and performing resinous sealing. CONSTITUTION:Because a pellet 4 is bonded on a tab 3 through a small piece 7 made of polyimide-isoindolo quinazolinedione (PIQ), a damp-proof property is enhanced so that damp-proof defects can be removed. Namely, a small piece 7 stuck on the rear surface of the pellet 4 touches a package 10 on the periphery of the pellet 4 and PIQ of the small piece 7 has much adhesiveness to resin of the package 10. Therefore, even if moisture invades the periphery of the small piece 7, moisture invasion inside the small piece can be completely suppressed.</p>
申请公布号 JPS6352423(A) 申请公布日期 1988.03.05
申请号 JP19860195368 申请日期 1986.08.22
申请人 HITACHI LTD 发明人 IMAI MINORU
分类号 H01L21/52;H01L21/301;H01L21/78;H01L23/28 主分类号 H01L21/52
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