| 摘要 |
PROBLEM TO BE SOLVED: To reduce a damage received by bumps formed on an insulation substrate, in a manufacturing step of a wiring substrate.SOLUTION: A wiring substrate 1 includes: an insulation substrate 2; wiring 3 formed on a main surface of the insulation substrate 2; and bumps 4 formed on the wiring 3. On a non-wiring forming portion on the insulation substrate 2, frame-shaped bump protecting portions 5 are formed so as to surround wiring forming portions. A relationship between projecting dimensions D1 of the bump 4 and projecting dimensions D2 of the bump protecting portion 5 with reference to the main surface of the insulation substrate is made to be D1≤D2. |
