| 摘要 |
PROBLEM TO BE SOLVED: To make a layer connecting part which electrically connects wiring layers, into narrow pitch by a simple method in a multilayer wiring board where a plurality of wiring layers are laminated via an insulating layer.SOLUTION: A method of manufacturing a multilayer wiring board which comprises at least a pair of first and second wiring layers disposed while facing each other and an insulating layer disposed between the wiring layers and in which the first wiring layer and the second wiring layer are electrically connected by a layer connecting part through the insulating layer includes the steps of: forming a mask pattern on the first wiring layer; partially performing roughening treatment on a surface of the first wiring layer via the mask pattern; removing the mask pattern and then forming the layer connecting part in a portion on which the roughening treatment has been performed, on the surface of the first wiring layer; forming the insulating layer on the surface of the first wiring layer in such a manner that the layer connecting part penetrates the insulating layer; and forming the second wiring layer on the insulating layer in such a manner that an apex of the layer connecting part is flattened. |
