| 摘要 |
PROBLEM TO BE SOLVED: To inhibit peeling and scattering of small pieces of a substrate from a dicing sheet.SOLUTION: A semiconductor device manufacturing method comprises: hydrophobizing a rear face of a substrate (step S100); subsequently, applying a dicing sheet to the rear face of the substrate (step S200); and subsequently dicing the substrate by pouring water on the substrate and singulating the substrate into semiconductor chips (step S210). By doing this, water can be inhibited from entering into a boundary between the substrate and the dicing tape in dicing. Accordingly, scattering of small pieces of the substrate can be inhibited in dicing. |
