发明名称 SEMICONDUCTOR LAYER MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor layer manufacturing method which can achieve high photoelectric conversion efficiency even when a layer having a large area is manufactured.SOLUTION: A semiconductor layer manufacturing method comprises: a process of preparing a base substrate A in which a film containing a metal element is arranged on a first principal surface of a substrate 1 having the first principal surface and a second principal surface on the opposite side to the first principal surface; a process of fixing the base substrate A to a third principal surface of a plate-like member 100 having the third principal surface having an outer shape larger than that of the base substrate A in such a way as to position the base substrate A on an inner side of an outer periphery of the third principal surface to form a laminate AA composed of the base substrate A and the plate-like member 100; a process of arranging the laminate AA in a furnace 101; and a process of making the film be a semiconductor layer including metal chalcogenide by heating the laminate while supplying chalcogen element to inside the furnace 101.
申请公布号 JP2014011188(A) 申请公布日期 2014.01.20
申请号 JP20120144601 申请日期 2012.06.27
申请人 KYOCERA CORP 发明人 KAMATA RUI;DOMOTO TATSUYA
分类号 H01L31/06 主分类号 H01L31/06
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