| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding head capable of cooling a tool base more promptly.SOLUTION: A bonding head 6 comprises a tool base 8 which is provided in a housing 6A for transmitting laser light L therethrough, and an electronic component 3 is heated by the laser light L transmitted through the tool base 8, and can be bonded to a substrate 2. In the tool base 8, a radiation member 15 is provided while bringing its surface into contact with a surface of the tool base to which the laser light L is made incident. The radiation member 15 has such light transmissivity as to transmit the laser light L therethrough and heat conductivity higher than that of the tool base 8. The tool base 8 is heated in the bonding process but heat transferred to the tool base 8 is speedily released to the radiation member 15 having high heat conductivity. Therefore, tact-up of a bonding device can be achieved by satisfactorily preventing temperature elevation of the tool base 8 at all the time. |
