| 摘要 |
PROBLEM TO BE SOLVED: To simultaneously prevent outflow of heat conduction grease applied between a semiconductor module and a heat sink and mixing of air into an application space by repetitive thermal curvature deformation of the semiconductor module due to exothermic heat and ambient temperature change of a semiconductor element.SOLUTION: In a semiconductor device 50, a plurality of grease storage parts 14 which are partitioned by a plurality of partition parts 51 and store heat conduction grease are formed on a radiator plate side surface 13 of a radiator plate 8. The heat conduction grease stored in the grease storage parts 14 prevents infiltration of air into an application space due to increase in the application space caused by a temperature cycle. The partition parts 51 are configured to prevent flow-down of the heat conduction grease outflowed from the application space due to decrease in the application space caused by the temperature cycle to the outside of a semiconductor module 1 by communicating with an adjacent grease storage part 14. |
