发明名称 CONDUCTIVE FILM FORMATION METHOD AND SINTERING PROMOTER
摘要 PROBLEM TO BE SOLVED: To form a conductive film having a low electrical resistance easily, in a conductive film formation method using the light sintering.SOLUTION: The conductive film formation method for forming a conductive film 5 by using the light sintering includes a step for forming a layer 22 composed of a sintering promoter 2 on a substrate, a step for depositing a liquid film 3 composed of a copper fine particle dispersion liquid on the layer 22 composed of the sintering promoter 2, a step for forming a copper fine particle layer 4 by drying the liquid film 3, and a step for light sintering the copper fine particle layer 4. The sintering promoter 2 is a compound for removing copper oxides from metal copper. With such an arrangement, the sintering promoter 2 removes surface oxide film of copper fine particles 31 in the light sintering.
申请公布号 JP2014011412(A) 申请公布日期 2014.01.20
申请号 JP20120149011 申请日期 2012.07.03
申请人 ISHIHARA CHEMICAL CO LTD 发明人 KAWATO YUICHI;MAEDA YUSUKE;KUDO TOMIO
分类号 H05K3/12;B22F3/22;B22F9/00;H01B13/00 主分类号 H05K3/12
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