| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure of a chip component which allows for minimization of reduction in the bond strength of a so-called thin low profile product.SOLUTION: In the structure of bonding a chip component, a pair of external terminal electrodes, provided at both ends thereof, are bonded to the lands in a pair of mounting boards facing each other, respectively, via solder. A perpendicular is drawn from an external terminal electrode formation edge in the ridge line of plane portion and side portion of the chip component, and the intersection of a land plane and a virtual land plane is set as a starting point. A perpendicular is drawn from the starting point toward the land edge on the side opposite from the conductor wiring lead-out side, and the intersection of the perpendicular with the land edge is set as an end point. When the distance from the starting point to the end point is defined as d, and the distance from the external terminal electrode formation edge to the starting point is defined as t, setting is performed to satisfy a relation d≥t/tan35°. The thickness is small when compared with the length and width of the chip component element. |
